Product Description
Company Info
Product Description
Used for Mirra equipments in the CMP Process of semiconductor, which is effective on Wafer Polishing as manufactured by Bonding SUS and PPS.
Specification: 200mm, 300mm wafer
Specification: 200mm, 300mm wafer
Address:
Room 1220, Hongcao Building, No 421 Hongcao Road, Shanghai, China
Business Type:
Manufacturer/Factory, Trading Company, Other
Business Range:
Manufacturing & Processing Machinery, Service
Main Products:
Semi, Led, Mems, O-Ring
Company Introduction:
AND corporation was founded in Jan 2001 with technique & Know-how accumulation for years in semiconductor industry.
AND is manufacturing brand new tools and refurbishment of Track/Scrubber including modification, upgrading, remodeling, and relocation.
In addition, AND also launched the MEMS tool manufacturing and process business in 2007. Further we devoted ourselves to the R&D activities through upgrading its advanced technology.
As proven in the peer market, excellent quality with intensive customer service is our strong confidence.
AND tried to be the best company in the world with fidelity.
AND is manufacturing brand new tools and refurbishment of Track/Scrubber including modification, upgrading, remodeling, and relocation.
In addition, AND also launched the MEMS tool manufacturing and process business in 2007. Further we devoted ourselves to the R&D activities through upgrading its advanced technology.
As proven in the peer market, excellent quality with intensive customer service is our strong confidence.
AND tried to be the best company in the world with fidelity.
